| LAMINATED SHEETS"NIKOLYTE ®" | HEAT-RESISTANT MATERIAL | PCB SOLDERING PALLET |


PRODUCT DETAILS

NIKKO PALLET - a high heat resistance PCB soldering pallet material.
These two types of materials can meet customers' requirement depending on the types in soldering process.
>NIKKO PALLET C : For dip soldering
>NIKKO PALLET R : For reflow soldering

NIKKO PALLET C is mainly used for dip soldering process. In addition to the excellent heat resistance and durability, it achieves necessary properties for soldering pallet such as anti-solder property preventing solder sticking, good chemical resistance preventing degradation with less influence by flux, and anti- static electricity protecting electric parts from static damage by discharging statics safe.
Also it enables precise machining with good machinability. Due to high strong structure made form glass fiber as base material, it can remain very thin wall by milling that is required spec for masking pallet for precision SMD.
 
Features
  • High heat resistance responding Pb free soldering(300)
  • Strong structure achieving precision milling (thinnest 0.8mm).
  • Good machinability enables speedy machining.
  • Anti-statics protecting SMD from statics damage(surface resistivity 106~108Ω ).
  • Low thermal conductivity protecting SMD from heat damage.
Advantages in using NIKKO PALLET C
  • Fixing width of soldering line.
  • Protecting SMD by masking effect.
  • Shortening products cycle time and bringing yields up.
  • Reducing soldering mistake by hand soldering.
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NIKKO PALLET R is mainly used for reflow soldering process. It achieves high resistance to creep from induced heat in actual use. In addition, its clean appearance outing less burr and powder dust after machining can be suitable for fixing or positioning jig for FPC soldering. Also it does not absorb heat at a reflow oven with its low thermal conductivity, as a result, it enable energy savings by bringing setting temperature lower than when a metal material is used.
 
Features
  • High heat resistance preventing creep under high temperature(350).
  • Good machinability outing less burr and powder dust.
  • Anti-statics protecting SMD from statics damage(surface resistivity 106~108Ω ).
  • Low thermal conductivity (thermal conductivity 0.58W/m·k)
Advantages in using NIKKO PALLET R
  • Staying fixed parallelism of PCB position during double-sided soldering.
  • Achieving steady soldering with preventing creep.
  • Setting lower oven temperature and shortening soldering cycle by low thermal conductivity.
  • Reducing heat stress to SMD and saving energy by lower setting temperature at oven.
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